Electronic device

ABSTRACT

The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 17/013,835, filed on Sep. 7, 2020. The content of the application isincorporated herein by reference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to a display device; more particularly, aflexible display device having a bonding pad.

2. Description of the Prior Art

Flexible display devices are widely used in daily life, and displaypanels of flexible display devices may be driven by integrated circuitchips and flexible circuit boards. Therefore, how to improve the qualityof electrical connections between the integrated circuit chips and thedisplay panel or between the flexible circuit boards and the displaypanel, or how to improve the display quality or reliability of flexibledisplay devices have become one of many important topics of discussion.

SUMMARY OF THE DISCLOSURE

To solve the abovementioned issues, an embodiment of the presentdisclosure provides an electronic device including a substrate, a firstmetal layer, a first insulating layer, a second insulating layer, asecond metal layer, a third via hole, a fourth via hole and a firsttransparent electrode. The substrate includes an active region and aperipheral region adjacent to the active region. The first metal layeris disposed on the substrate. The first insulating layer is disposed onthe first metal layer and includes a first via hole in the peripheralregion. The second insulating layer is disposed on the first insulatinglayer and includes a second via hole in the peripheral region. Thesecond metal layer is disposed between the first metal layer and thesecond insulating layer. The third via hole penetrates through thesecond insulating layer and exposes a portion of the second metal layerin the peripheral region. The fourth via hole penetrates through thefirst insulating layer and the second insulating layer and exposes aportion of the first metal layer in the peripheral region. The firsttransparent electrode is disposed on the first insulating layer. Thefirst transparent electrode is electrically connected to the first metallayer through the fourth via hole and electrically connected to thesecond metal layer through the third via hole.

Another embodiment of the present disclosure provides an electronicdevice including a substrate, a first metal layer, a first insulatinglayer, a second insulating layer, a second metal layer, a first viahole, a second via hole and a first transparent electrode. The substrateincludes an active region and a peripheral region adjacent to the activeregion. The first metal layer is disposed on the substrate. The firstinsulating layer is disposed on the first metal layer. The secondinsulating layer is disposed on the first insulating layer. The secondmetal layer is disposed between the first metal layer and the secondinsulating layer. The first via hole penetrates through the firstinsulating layer and the second insulating layer and exposes a portionof the first metal layer in the peripheral region. The second via holepenetrates through the second insulating layer and exposes a portion ofthe second metal layer in the peripheral region. The first transparentelectrode is disposed on the second insulating layer, and the firsttransparent electrode is electrically connected to the first metal layerthrough the first via hole and electrically connected to the secondmetal layer through the second via hole.

Another embodiment of the present disclosure provides a flexible displaydevice including a substrate, a first metal layer, a first insulatinglayer and a second insulating layer. The substrate includes an activeregion and a peripheral region adjacent to the active region. The firstmetal layer is disposed on the substrate. The first insulating layer isdisposed on the first metal layer, and the first insulating layerincludes a first via hole disposed in the peripheral region. The secondinsulating layer is disposed on the first insulating layer, and thesecond insulating layer includes a second via hole. In a top viewdirection of the flexible display device, the first via hole is disposedwithin the second via hole, and the second via hole exposes a portion ofa top surface of the first insulating layer.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a flexible display device according to anembodiment of the present disclosure.

FIG. 2 is an enlarged schematic diagram of one of a plurality of bondingpads according to an embodiment of the present disclosure.

FIG. 3 is a schematic diagram of a sectional view along a section lineA-A′ in FIG. 2.

FIG. 4 is an enlarged schematic diagram of a transfer structureaccording to an embodiment of the present disclosure.

FIG. 5 illustrates schematic diagrams of sectional views along a sectionline B-B′ and a section line C-C′ in FIG. 4.

FIG. 6 illustrates a schematic diagram of a sectional view along asection line D-D′ in FIG. 4.

FIG. 7 is a schematic diagram showing a partial sectional view of one ofthe bonding pads according to some embodiments of the presentdisclosure.

FIG. 8 is a schematic diagram showing a partial sectional view of one ofthe bonding pads according to some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

The present disclosure may be understood by reference to the followingdetailed description, taken in conjunction with the drawings asdescribed below. It is noted that, for purposes of illustrative clarityand being easily understood by the readers, various drawings of thisdisclosure may be simplified schematic diagrams that partiallyillustrate a portion of an electronic device or a portion of a flexibledisplay device; certain components within may not be drawn to scale. Inaddition, the number and dimension of each component shown in drawingsare only illustrative and are not intended to limit the scope of thepresent disclosure.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, electronic equipment manufacturers may refer to a componentby different names. This document does not intend to distinguish betweencomponents that differ in name but not in function. In the followingdescription and in the claims, the terms “include”, “comprise” and“have” are used in an open-ended fashion, and thus should be interpretedto mean “include, but not limited to . . . ”.

It will be understood that when an element or layer is referred to asbeing “on,” “disposed on” or “connected to” another element or layer, itcan be directly on or directly connected to the other element or layer,or intervening elements or layers may be presented (indirect condition).In contrast, when an element is referred to as being “directly on” or“directly connected to” another element or layer, there are nointervening elements or layers presented.

The terms “about,” “substantially,” “equal,” or “same” generally referto values falling within 20% of a given value or range, or to valuesfalling within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

Although terms such as first, second, third, etc., may be used todescribe diverse constituent elements, such constituent elements are notlimited by the terms. The terms are used only to discriminate aconstituent element from other constituent elements in thespecification. The claims may not use the same terms, but instead mayuse the terms first, second, third, etc. with respect to the order inwhich an element is claimed. Accordingly, in the following description,a first constituent element may be a second constituent element in aclaim. Additionally, the terms first, second, third, etc. may notindicate an order of production or process.

It should be noted that the technical features in different embodimentsdescribed in the following description may be replaced, recombined, ormixed with one another to constitute another embodiment withoutdeparting from the spirit of the present disclosure.

An electronic device according to the present disclosure may include adisplay device, an antenna device, a light-emitting device, a sensingdevice, or a tiled device, but not limited thereto. The electronicdevice may include foldable or flexible electronic devices. The displaydevice may include a self-emitting type organic light-emitting diode(OLED), an inorganic light-emitting diode (LED) such as a minilight-emitting diode (mini LED), a micro light-emitting diode (microLED), quantum dot (QD) materials, a quantum dot light-emitting diode(quantum dot LEDs, QLEDs, QDLEDs), fluorescent materials, phosphorescentmaterials, other suitable materials or a combination of the abovematerials and devices, but not limited thereto. Concepts or principlesof the present disclosure may also be applied in non-self-emitting typesof displays such as liquid crystal displays (LCDs), but not limitedthereto.

The antenna device may for example be a liquid crystal antenna or othertypes of antenna devices, but the present disclosure is not limitedthereto. The tiled device may for example be a tiled display device, atiled antenna device or a combination thereof, but the presentdisclosure is not limited thereto. It should be noted that, theelectronic device may be a combination of the aforementioned devices,but the present disclosure is not limited thereto. Additionally, anouter shape of the electronic device may be rectangular, spherical,polygonal, a shape with a curved edge or other suitable shapes. Theelectronic device may have driving systems, control systems, lightingsystems, shelving systems etc. as peripheral systems to support thedisplay device, the antenna device or the tiled device. In the followingdescription, the flexible display device is illustrative of an exampleof the electronic device of the present disclosure, but the presentdisclosure is not limited thereto.

Please refer to FIG. 1, which illustrates a top view of a flexibledisplay device according to a first embodiment of the presentdisclosure. The electronic device or the flexible display device 10 ofthe present embodiment may include a substrate 100 that may include anactive region R1 and a peripheral region R2 adjacent to the activeregion R1, and the peripheral region R2 may for example be configured onat least one side of the active region R1. As shown in FIG. 1, theperipheral region R2 may surround the active region R1. The activeregion R1 may include a display region, a detection region, a sensingregion, an emitting region, an operating region, other suitable regionsor a combination of the aforementioned regions, but not limited thereto.

The substrate 100 may include a flexible substrate, but not limitedthereto. Materials of the substrate 100 may include organic or inorganicflexible materials, but not limited thereto. If the material of thesubstrate 100 is an organic polymer, the substrate 100 may for exampleinclude polyimide (PI), polyethylene terephthalate (PET), polycarbonate(PC) or a combination of the aforementioned materials, but not limitedthereto. Furthermore, a top-view shape of the substrate 100 may be arectangle, a shape with a curved edge or any suitable shapes withoutlimitation.

The flexible display device 10 may include a plurality of scan lines 102and a plurality of data lines 104 disposed on the substrate 100. Thescan lines 102 may extend along a first direction D1, the data lines 104may extend along a second direction D2, and the second direction D2 isdifferent from the first direction D1. The first direction D1 and thesecond direction D2 of the present embodiment may for example beperpendicular to each other, but not limited thereto. Additionally, thescan lines 102 may intersect the data lines 104 to define a plurality ofsub-pixels, such as a sub-pixel 106R, a sub-pixel 106G, and a sub-pixel106B in FIG. 1, but not limited thereto. For example, the sub-pixel 106Rmay correspond to a red sub-pixel, the sub-pixel 106G may correspond toa green sub-pixel, the sub-pixel 106B may correspond to a bluesub-pixel, and a color image may be displayed through light of differentcolors generated by the sub-pixels, but not limited thereto. The lightprovided by the sub-pixels may be designed based on demand. Furthermore,a top-view shape of the sub-pixel may be a rectangle, a parallelogram, a“>” shape, or any suitable shapes without limitation.

As shown in FIG. 1, the data lines 104 may extend from the active regionR1 to the peripheral region R2 along the second direction D2, and atleast one of the data lines 104 may be electrically connected to atransfer structure 108, but not limited thereto. The flexible displaydevice 10 may include a plurality of transfer structures 108 disposedadjacent to the active region R1 and along the first direction D1 oralong an edge of the active region R1, but not limited thereto. Usingone of the transfer structures 108 as an illustrative example, it may benoticed that an end of the transfer structure 108 may be electricallyconnected to the data line 104, and another end of the transferstructure 108 may be electrically connected to a conductive line 110,but not limited thereto. The transfer structure 108 may also beelectrically connected to other signal lines in the active region R1.Through the transfer structures 108, the data lines 104 in the activeregion R1 may be electrically connected to the conductive lines 110 inthe peripheral region R2, or a metal layer of the data lines 104 may beelectrically connected to another metal layer of the conductive lines110 through the transfer structures 108. Herein, various metal layers ofthe flexible display device 10 may be produced or formed using a singleproduction process and subsequently patterned to form different sectionsor layers; alternatively, the various metal layers may be producedand/or formed using separate production processes. For example, once ametal layer is formed on the substrate 100, the metal layer may bepatterned using photolithography processes to divide the metal layerinto various sections, shapes or thicknesses. The various sections ofmetal layers may also be formed separately using individual productionprocesses, each process for producing a section of the metal layer. Theproduction processes are not limited to those described above; anyproduction process suitable for producing the metal layers may suffice.

The phrase “electrically connected to” of the present disclosure canrefer to two conductors or semiconductors being directly connected toachieve electrical connectivity, or the phrase may refer to twoconductors or semiconductors being connected through other elements toachieve electrical connectivity, but not limited thereto.

The flexible display device 10 may include a plurality of bonding pads112 and a plurality of bonding pads 114 disposed on the substrate 100,and the bonding pads 112 and the bonding pads 114 may be disposed alongthe first direction D1, but not limited thereto. On the other hand,along the second direction D2, the transfer structures 108 may forexample be disposed adjacent to the active region R1, the bonding pads114 may for example be disposed adjacent to an edge of the substrate100, and the bonding pads 112 may be disposed between the bonding pads114 and the transfer structures 108, but not limited thereto. Using oneof the bonding pads 112 as an illustrative example, it may be noticedthat an end of the bonding pad 112 may be electrically connected to aconductive line 110, and another end of the bonding pad 112 may beelectrically connected to a conductive line 116, but not limitedthereto. Furthermore, an end of the conductive line 116 may beelectrically connected to a bonding pad 112, and another end of theconductive line 116 may be electrically connected to a bonding pad 114,but not limited thereto. In such manner, the bonding pads 112 may beelectrically connected to the bonding pads 114. Quantities and positionsof the bonding pads 112, the bonding pads 114 and the transferstructures 108 are not limited to those shown in FIG. 1.

In some embodiments (not illustrated), some bonding pads 112 may not beelectrically connected to the transfer structures 108, and may beelectrically connected to other electrical components of the flexibledisplay device 10 such as driver circuits, detection circuits, and/orsensing circuits through conductive lines, but not limited thereto.

The flexible display device 10 may include an integrated circuit chip118 and a flexible circuit board 120. The integrated circuit chip 118and the flexible circuit board 120 may be disposed on the substrate 100,the integrated circuit chip 118 may be electrically connected to thebonding pads 112, and the flexible circuit board 120 may be electricallyconnected to the bonding pads 114. For example, the integrated circuitchip 118 may include a plurality of bonding pads disposed on a surfaceof the integrated circuit chip 118, and at least a portion of thebonding pads of the integrated circuit chip 118 has positionscorresponding to the bonding pads 112 and may be connected (e.g.,electrically connected) to the bonding pads 112. On the other hand, theflexible circuit board 120 may include a plurality of bonding padsdisposed on a surface of the flexible circuit board 120, and at least aportion of the bonding pads of the flexible circuit board 120 haspositions corresponding to the bonding pads 114 and may be connected(e.g., electrically connected) to the bonding pads 114. Quantities andpositions of the integrated circuit chip 118 and the flexible circuitboard 120 are not limited to those shown in FIG. 1.

Please refer to FIG. 2 and FIG. 3, wherein FIG. 2 is an enlargedschematic diagram of one of the bonding pads 112 according to the firstembodiment of the present disclosure, and FIG. 3 is a schematic diagramof a sectional view along a section line A-A′ in FIG. 2. One of thebonding pads 112 of the flexible display device 10 may include a metallayer 122, an insulating layer 124, an insulating layer 126, aninsulating layer 128, a plurality of transparent electrodes 130 and atransparent electrode 132, but not limited thereto. As shown in FIG. 2,the conductive line 110 and the conductive line 116 may be a linearportion extended from the metal layer 122; in some embodiments, theconductive line 110 and the conductive line 116 may be directlyconnected to the metal layer 122 of the bonding pad 112, but not limitedthereto. As shown in FIG. 3, the insulating layer 124 and the insulatinglayer 126 may be disposed on the metal layer 122, and the insulatinglayer 124 and/or the insulating layer 126 may include a plurality of viaholes 134. The via holes 134 may be disposed in the peripheral region R2of the substrate 100, and the via holes 134 may penetrate through theinsulating layer 124 and the insulating layer 126, such that a portionof a surface of the metal layer 122 may be exposed by the via holes 134.In some embodiments, one of the transparent electrodes 130 may bedisposed in one of the via holes 134, and the transparent electrode 130may directly contact the portion of the surface of the metal layer 122exposed by the via holes such that the transparent electrode 130 may beelectrically connected to the metal layer 122, but not limited thereto.

In some embodiments, quantities of the via holes 134 and quantities ofvia holes 136 are not limited to be more than one; in some embodiments,the bonding pads 112 or the bonding pads 114 may include one via hole134 and one via hole 136. In a top view direction D3 of the flexibledisplay device 10, the via holes 134 are disposed within the via holes136 (as shown in FIG. 2). In some embodiments, as shown in FIG. 3, theinsulating layer 128 comprises a side wall 128 w surrounding the viahole 136, and the insulating layer 124 and the insulating layer 126respectively comprise a side wall 124 w and a side wall 126 wsurrounding the via hole 134. When viewed from centers of the via holes134 and the via holes 136, the side wall 126 w surrounding the via hole134 may be disposed inside the side wall 128 w surrounding the via hole136. In some embodiments, the insulating layer 128 may be disposed onthe insulating layer 126, and the insulating layer 128 may include aplurality of via holes 136. The via holes 136 may penetrate through theinsulating layer 128 such that portions of a surface of the transparentelectrode 130 may be exposed by the via holes 136. As shown in FIG. 3,one of the via holes 136 may expose a portion 1261 s of a top surface1261 of the insulating layer 126. Specifically, the transparentelectrode 130 may include a portion 130 a of the transparent electrodeand a portion 130 b of the transparent electrode, wherein the portion130 a of the transparent electrode 130 is disposed in the via hole 134,the portion 130 b of the transparent electrode 130 is disposed on theportion 1261 s of the top surface 1261 of the insulating layer 126. Insome embodiments, the portion 130 b of the transparent electrode 130 maycover the portion 1261 s of the top surface 1261 while extending along adirection away from the via holes 134 to be disposed between theinsulating layer 126 and the insulating layer 128, and along the topview direction D3, the side wall 128 w may be disposed between an edgeEG of the portion 130 b of the transparent electrode 130 and the sidewall 126 w, but not limited thereto. In some embodiments, the portion130 b of the transparent electrode 130 directly contacts the insulatinglayer 126 and the insulating layer 128. In some embodiments, the edge EGof the portion 130 b of the transparent electrode 130 may extend beyondthe side wall 128 w and the side wall 126 w, but not limited thereto.

Additionally, the via holes 136 may have a diameter DI1, and the viaholes 134 may have a diameter DI2. As shown in FIG. 3, the diameter DI1may be obtained by measuring a minimum width of a bottom profile of theside wall 128 w of the insulating layer 128, and the diameter DI2 may beobtained by measuring a minimum width of a bottom profile of the sidewall 124 w of the insulating layer 124, but not limited thereto. In thepresent embodiment, the diameter DI1 may be greater than the diameterDI2. The diameter DI1 of the via holes 136 may be greater than or equalto 15 micrometers and less than or equal to 20 micrometers, but notlimited thereto.

Regarding measurements of the diameter DI1 and the diameter DI2, anoptical microscope (OM), a scanning electron microscope (SEM), aprofilometer (α-step), an ellipsometer or other methods suitable formeasuring distance/thickness may be used when necessary. Specifically,in some embodiments, a scanning electron microscope is used to obtain asectional image of a structure, and a minimum width seen in anysectional image is measured; or, an optical microscope is used to obtaina top-view image of a structure, and a minimum width seen in anytop-view image is measured.

The transparent electrode 132 may be disposed on the insulating layer128 and the transparent electrode 130, and the transparent electrode 132may at least partially cover the insulating layer 128 and thetransparent electrode 130, but not limited thereto. The transparentelectrode 132 may be electrically connected to the metal layer 122through the via holes 136 and the via holes 134. For example, thetransparent electrode 132 may directly contact portions of the surfaceof the transparent electrode 130 exposed by the via holes 136, such thatthe transparent electrode 132 may be electrically connected to the metallayer 122 through the transparent electrodes 130, but not limitedthereto. In some embodiments, since the transparent electrode 132 mayfill into the via holes 136, portions of the top surface of thetransparent electrode 132 on the via holes 136 may be concave surfaces.Similarly, portions of the top surface of the transparent electrode 130on the via holes 134 may also be concave surfaces.

Additionally, as shown in FIG. 3, an included angle α is formed betweenthe side wall 128 w and the substrate 100, and the included angle α maybe greater than or equal to 45 degrees and less than or equal to 60degrees. Designing the included angle α to be greater than or equal to45 degrees may improve the coverage of the transparent electrode 132filled into the via holes 136. Furthermore, considering the limit ofproduction equipment, the included angle α may be designed to be lessthan or equal to 60 degrees, but not limited thereto. An included angleβ is formed between the side wall 124 w and the substrate 100; in someembodiments, a range of the included angle β may be equal to a range ofthe included angle α and may have aforementioned functions, but notlimited thereto. In some embodiments, the included angle β may bedifferent from the included angle α, and a slope of the side wall 124 wmay be different from a slope of the side wall 128 w. In someembodiments, the side wall 124 w, the side wall 126 w and the side wall128 w may have different slopes, or two of the side wall 124 w, the sidewall 126 w, and the side wall 128 w may have different slopes, but notlimited thereto.

As shown in FIG. 2 and FIG. 3, in the bonding pad 112 of the presentembodiment, the transparent electrodes 130 are not formed on theinsulating layer 126 as a continuous surface. The transparent electrodes130 of the present embodiment may be a plurality of separate electrodes(for example, transparent electrodes 130 and transparent electrodes 130g); the plurality of transparent electrodes 130 may be separatelydisposed in the corresponding via holes 134 and partially cover portions1261 s of the top surface 1261 of the insulating layer 126 adjacent tothe via holes 134. The insulating layer 124 and/or the insulating layer126 further comprise a via hole 134 (134 a) adjacent to the via hole134, the insulating layer 128 further comprises a via hole 136 (136 a)adjacent to the via hole 136, and the via hole 134 (134 a) is disposedwithin the via hole 136 (136 a) in the top view direction D3. Thetransparent electrode 132 is electrically connected to the metal layer122 through the via hole 136 (136 a) and the via hole 134 (134 a). Oneof the plurality of transparent electrodes 130 may be disposed withinthe via hole 134, and another one of the plurality of transparentelectrodes 130 (130 g) may be disposed within the via hole 134 (134 a).The transparent electrode 132 is electrically connected to the metallayer 122 through one of the transparent electrodes 130 and another oneof the transparent electrode 130 (130 g), but the present disclosure isnot limited thereto. The transparent electrode 130 is separate fromanother transparent electrode 130 (130 g).

In such manner, a contact area of a heterogeneous interface between thetransparent electrode 130 and the insulating layer 126 may be reduced,or a contact area of a heterogeneous interface between the transparentelectrode 130 and the insulating layer 128 may be reduced, such that aprobability of peeling or cracking due to the heterogeneous interfacesbetween dissimilar materials may be reduced. On the other hand, thepresent embodiment utilizes two via holes (such as the via hole 134 andthe via hole 136) that penetrate through the insulating layer 124, theinsulating layer 126 and the insulating layer 128. When compared tousing only one via hole to penetrate the insulating layer 124, theinsulating layer 126 and the insulating layer 128, methods utilized inthe present embodiment can save process time or reduce the size of thevia holes.

The bonding pads 114 may have structures and features similar to thebonding pads 112, as described above and shown in FIG. 2 and FIG. 3. Insome embodiments, the bonding pads 114 may be designed to have a size(area) or a quantity of via holes that are different from the bondingpads 112, but not limited thereto. In some embodiments, an end of thebonding pads 114 may connect with the conductive lines 116, and anotherend of the bonding pads 114 may not be connected to the conductivelines.

As shown in FIG. 1, the flexible display device 10 may include atransparent electrode 138 disposed in the peripheral region R2, and aportion of the transparent electrode 138 may extend into the activeregion R1, but not limited thereto. The transparent electrode 138 may bedisposed on the transfer structures 108 or may at least partially coverthe transfer structures 108. The transparent electrode 138 may protectcomponents underneath, but not limited thereto. Please refer to FIG. 4through FIG. 6. FIG. 4 is an enlarged schematic diagram of the transferstructure according to some embodiments of the present disclosure. FIG.5 illustrates schematic diagrams of sectional views along a section lineB-B′ and a section line C-C′ in FIG. 4. FIG. 6 illustrates a schematicdiagram of a sectional view along a section line D-D′ in FIG. 4. Asshown in FIG. 4 and FIG. 5 and using one of the transfer structures 108as an illustrative example, it may be noticed that a metal layer 142 maybe disposed between the metal layer 122 and the insulating layer 126.More specifically, the metal layer 142 may be disposed between theinsulating layer 124 and the insulating layer 126. As shown in FIG. 4,the data lines 104 may be linear portions of the metal layer 142extended therefrom, and the data lines 104 may be directly connected tothe metal layer 142 of the transfer structures 108, but not limitedthereto. Furthermore, the conductive lines 110 (that is, the linearportions of the metal layer 122 extended therefrom) may be directlyconnected to the metal layer 122 of the transfer structures 108, but notlimited thereto.

As shown in FIG. 5, the insulating layer 126 is disposed on the metallayer 142, and the via hole 144 may penetrate through the insulatinglayer 126 and expose a portion of the metal layer 142; the via hole 146may penetrate through the insulating layer 124 and the insulating layer126 and expose a portion of the metal layer 122. In some embodiments,the transparent electrode 130 may be disposed in the via hole 144 andthe via hole 146, and the transparent electrode 130 may at leastpartially cover the top surface 1261 of the insulating layer 126, butnot limited thereto. In some embodiments, the transparent electrode 130may directly contact a portion of a surface of the metal layer 142exposed by the via hole 144 and a portion of a surface of the metallayer 122 exposed by the via hole 146, so that the transparent electrode130 may be electrically connected to the metal layer 122 through the viahole 146 and be electrically connected to the metal layer 142 throughthe via hole 144, but not limited thereto. The insulating layer 128covers the transparent electrode 130, and the insulating layer 128 isdisposed between the transparent electrode 138 and the transparentelectrode 130. In some embodiments, as shown in FIG. 4, the data lines104 and the conductive lines 110 may be electrically connected throughthe transfer structures 108. The metal layer 122 and the metal layer 142shown in FIG. 5 may be electrically connected through the transparentelectrode 130.

As shown in FIG. 5, the transparent electrode 130 on the via hole 144may include a portion 130 c and another portion 130 d, wherein theportion 130 c is disposed in the via hole 144, and the portion 130 d isdisposed on a portion 1261 t of the top surface 1261 of the insulatinglayer 126. The transparent electrode 130 on the via hole 146 may includea portion 130 e and another portion 130 d, wherein the portion 130 e isdisposed in the via hole 146, and the portion 130 d is disposed on aportion 1261 r of the top surface 1261 of the insulating layer 126. Insome embodiments, a top surface of the transparent electrode 130 on thevia hole 144 and the via hole 146 may be concave surfaces. In thetransfer structure 108 of the present embodiment, by reducing an area ofthe transparent electrode 130 (such as reducing the area to be less thanan area of the metal layer 122 under the transparent electrode 130) toreduce the contact area of the heterogeneous interface between thetransparent electrode 130 and the insulating layer 126 or reduce thecontact area of the heterogeneous interface between the transparentelectrode 130 and the insulating layer 128, the probability of peelingor cracking due to the heterogeneous interfaces between dissimilarmaterials may be reduced.

As shown in FIG. 1, the flexible display device 10 may include atransparent electrode 140 disposed in the peripheral region R2. Thetransparent electrode 140 may be disposed on the insulating layer 128.Along the second direction D2, the transparent electrode 140 may bedisposed between the transparent electrode 138 and the integratedcircuit chip 118, but not limited thereto. As shown in FIG. 4 and FIG.6, the transparent electrode 140 may be disposed on the conductive lines110 (the conductive lines 110 being the linear portions of the metallayer 122 in the peripheral region R2) or may at least cover a portionof the conductive lines 110, and the transparent electrode 140 covers aportion of the conductive lines 110 and exposes another portion of theconductive lines 110. The transparent electrode 140 may protectcomponents underneath, but not limited thereto. In the flexible displaydevice 10 of the present embodiment, no transparent electrodes (such asthe transparent electrode 130) are disposed between the insulating layer126 and the insulating layer 128 under the transparent electrode 140; inthis manner, heterogeneous interfaces between transparent electrodes andthe insulating layer 126 or between transparent electrodes and theinsulating layer 128 may be reduced, thereby reducing the probability ofpeeling or cracking due to the heterogeneous interfaces betweendissimilar materials. Additionally, quantities and positions of thetransparent electrode 138 and the transparent electrode 140 of thepresent disclosure are not limited to those shown in FIG. 1.

In the present embodiment, the metal layer 122 and the metal layer 142may include a single-layered structure or a multi-layered structure. Themetal layer 122 and the metal layer 142 may include metals (such assilver (Ag), copper (Cu), aluminum (Al), molybdenum (Mo) or alloysthereof), metal oxides, metal nitrides, other suitable conductivematerials or a combination of aforementioned materials, but not limitedthereto. In some embodiments, the metal layer 122 may for example be atwo-layered structure including aluminum and molybdenum or aluminum andmolybdenum nitride (Mo₂N), and the metal layer 142 may for example be athree-layered structure including molybdenum/aluminum/molybdenum ormolybdenum nitride/aluminum/molybdenum nitride, but not limited thereto.

The insulating layer 124, the insulating layer 126 and the insulatinglayer 128 may include a single-layered structure or a multi-layeredstructure. Materials for the insulating layer 124, the insulating layer126 and the insulating layer 128 may include inorganic insulatingmaterials and organic insulating materials. Silicon oxide (SiO), siliconnitride (SiN), silicon oxynitride (SiON), other suitable insulatingmaterials or combinations thereof are illustrative examples of inorganicinsulating materials, but not limited thereto. Organic resin, organicpolymer film on array (organic PFA), other suitable insulating materialsor combinations thereof are illustrative examples of organic insulatingmaterials, but not limited thereto. In some embodiments, the insulatinglayer 124 may be a gate insulating layer, wherein the gate insulatinglayer may for example be a single layer including silicon nitride or athree-layered structure of silicon nitride/amorphous silicon/n-typedoped silicon, but not limited thereto. The insulating layer 126 and theinsulating layer 128 may for example be a single layer including siliconnitride, but not limited thereto.

Materials for the transparent electrode 130, the transparent electrode132, the transparent electrode 138 and the transparent electrode 140 mayinclude indium tin oxide (ITO), indium zinc oxide (IZO), indium galliumzinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide(ATO), antimony zinc oxide (AZO), other suitable transparent conductivematerials or combinations of aforementioned materials, but not limitedthereto.

Subsequent paragraphs will continue to detail other embodiments of thepresent disclosure. For simplicity, identical elements will be denotedby the same reference signs. To illustrate the differences betweenvarious embodiments, the differences between various embodiments will bedescribed in more detail in the following paragraphs while omittingdescriptions regarding previously discussed features.

Please refer to FIG. 7, which is a schematic diagram showing a partialsectional view of one of the bonding pads according to some embodimentsof the present disclosure. FIG. 7 may illustrate a sectional structureof the via hole 134 and the via hole 136 of the bonding pads 114 or thebonding pads 112 according to above embodiments. The via holes 134 ofthe present embodiments are not disposed with the transparent electrodes130; only the transparent electrodes 132 fill in the via holes 134 andthe via holes 136 and directly contact the metal layer 122.

Please refer to FIG. 8, which is a schematic diagram showing a partialsectional view of one of the bonding pads according to some embodimentsof the present disclosure. The portion 130 b of the transparentelectrode 130 of the present embodiments may be disposed on the portion1261 s of the top surface 1261 of the insulating layer 126 exposed bythe via holes 136, and partially cover the portion 1261 s of the topsurface 1261. Therefore, a portion of the portion 1261 s of the topsurface 1261 may not be covered by the portion 130 b of the transparentelectrode 130, or an edge EG of the portion 130 b of the transparentelectrode 130 may be disposed between the side wall 128 w and the sidewall 126 w, but not limited thereto.

In summary, in the bonding pads of the electronic device or the flexibledisplay device of the present disclosure, one of the layers of thetransparent electrodes is not a layer that is formed continuously on theinsulating layer but a layer of a plurality of separable electrodes. Thetransparent electrodes may be separately disposed in corresponding viaholes and partially cover portions of the top surface of the insulatinglayer that are adjacent to the via holes. In this manner, the contactarea of the heterogeneous interface between the transparent electrodeand the insulating layer above or below the transparent electrode may bereduced, such that the probability of peeling or cracking due to theheterogeneous interfaces between dissimilar materials may be reduced.Furthermore, at the transfer structures in the peripheral region or atlocations above some conductive lines, the area of the transparentelectrode may be reduced to reduce the contact area of the heterogeneousinterface between the transparent electrode and the insulating layer,such that the probability of peeling or cracking due to theheterogeneous interfaces between dissimilar materials may be reduced.

Even though embodiments and advantages of the present disclosure havebeen described as above, it should be understood that the descriptiondoes not limit the scope of the present disclosure. Those skilled in theart may modify, substitute, combine or amend features of the presentdisclosure without departing from the essence and scope of the presentdisclosure.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. An electronic device, comprising: a substratecomprising an active region and a peripheral region adjacent to theactive region; a first metal layer disposed on the substrate; a firstinsulating layer disposed on the first metal layer and comprising afirst via hole in the peripheral region; a second insulating layerdisposed on the first insulating layer and comprising a second via holein the peripheral region; a second metal layer disposed between thefirst metal layer and the second insulating layer; a third via holepenetrating through the second insulating layer and exposing a portionof the second metal layer in the peripheral region; a fourth via holepenetrating through the first insulating layer and the second insulatinglayer and exposing a portion of the first metal layer in the peripheralregion; and a first transparent electrode disposed on the secondinsulating layer, wherein the first transparent electrode iselectrically connected to the first metal layer through the fourth viahole and electrically connected to the second metal layer through thethird via hole.
 2. The electronic device according to claim 1, whereinthe first via hole is disposed within the second via hole, and thesecond via hole exposes a portion of a top surface of the firstinsulating layer in a top view direction of the electronic device. 3.The electronic device according to claim 1, wherein the firsttransparent electrode directly contacts the first metal layer and thesecond metal layer.
 4. The electronic device according to claim 1,wherein a thickness of the first transparent electrode is less than athickness of the first metal layer.
 5. The electronic device accordingto claim 1, wherein a thickness of the first transparent electrode isless than a thickness of the second metal layer.
 6. The electronicdevice according to claim 1, wherein in a top view of the electronicdevice, a length of the first metal layer is different from a length ofthe second metal layer.
 7. The electronic device according to claim 6,wherein in the top view of the electronic device, the length of thefirst metal layer is greater than the length of the second metal layer.8. The electronic device according to claim 1, wherein the firsttransparent electrode comprises a first portion, a second portion and athird portion, wherein the first portion is disposed within the thirdvia hole, the second portion is disposed within the fourth via hole, andthe third portion is disposed on a portion of a top surface of thesecond insulating layer.
 9. The electronic device according to claim 1,wherein in a top view of the electronic device, a length of the firsttransparent electrode is different from a length of the second metallayer.
 10. The electronic device according to claim 9, wherein in thetop view of the electronic device, the length of the first transparentelectrode is greater than the length of the second metal layer.
 11. Theelectronic device according to claim 1, wherein a diameter of the secondvia hole is greater than a diameter of the first via hole.
 12. Anelectronic device, comprising: a substrate comprising an active regionand a peripheral region adjacent to the active region; a first metallayer disposed on the substrate; a first insulating layer disposed onthe first metal layer; a second insulating layer disposed on the firstinsulating layer; a second metal layer disposed between the first metallayer and the second insulating layer; a first via hole penetratingthrough the first insulating layer and the second insulating layer andexposing a portion of the first metal layer in the peripheral region; asecond via hole penetrating through the second insulating layer andexposing a portion of the second metal layer in the peripheral region;and a first transparent electrode disposed on the second insulatinglayer, wherein the first transparent electrode is electrically connectedto the first metal layer through the first via hole and electricallyconnected to the second metal layer through the second via hole.